Will Burke has been invited to judge next year’s first annual The Dieline Awards, a worldwide design competition recognizing the best in package design. Launched by thedieline.com, the world’s leading package design Web site, the competition will be held in conjunction with the 2010 FUSE Conference, taking place in Chicago on April 14^th, 2010.

30 winners across 10 different categories will be awarded a prestigious Dieline Award, with one Best of Show winner. Will is one of only ten industry experts on the judging panel.

Click here for more information on the competition.